The COM chip is positioned on the assembly surface of the optical lens, and it cooperates with GALAXYCORE's patent of the red glue-free module process to avoid FPC deformation, red glue stress and the Tilt problem caused by Holder Mount has better optical system and better MTF performance.
COM adopts gold wire soldering technology, the layer thickness is not high, which greatly improves the adaptability of FPC.
The COM module can dissipate heat by convection of the air medium around the base bracket and the back, and the heat dissipation efficiency is high.
COM modules can use FPC, which is more automated than COB, and can have both performance and cost advantages.
COM Packaging and module manufacturing process
